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Laser Powder Bed Fusion (L-PBF) · CuCrZr (UNS C18150)

L-PBF Copper (CuCrZr)

Precipitation-hardened copper for high-conductivity thermal hardware. Standard for printed rocket combustion chambers and conformal heat sinks.

Allowables
UTS380 – 460MPa
Yield280 – 360MPa
Elongation18 – 30%
Fatigue (R = -1, 10⁷)140 – 180MPa
Density8.90g/cm³

Condition: Solution 980 °C + age 480 °C / 3 h

When to pick this combination

L-PBF CuCrZr is the dominant route for printed combustion-chamber liners, regen-cooled rocket-engine sections, and conformal heat sinks for power electronics. The precipitation age recovers ~75% of wrought-copper conductivity (~80% IACS) while retaining usable strength.

  • Rocket combustion-chamber liners with regen cooling
  • Power-electronics conformal heat sinks
  • Induction-heating workhead liners
  • Thermal-management housings

Typical defects and how the model accounts for them

Pure copper reflects ~90% of standard near-IR laser energy, making it borderline unprintable on legacy machines. CuCrZr's Cr and Zr additions raise absorptivity enough to print on green-laser or high-power IR systems. Density depends critically on machine class.

Required post-processing

The allowables above assume the full post-processing chain. Skipping any step degrades the row by 15–35 %.

  • Stress relief: 350 °C / 2 h / Ar
  • Solution: 980 °C / 1 h / WQ
  • Age: 480 °C / 3 h / AC
  • Machine sealing flanges
  • Verify IACS conductivity on coupon

Suggested build parameters

Starting recipe; tune against first-article inspection on geometry-sensitive features.

  • Layer: 30 μm
  • Laser: ≥ 400 W (green) or ≥ 700 W (IR)
  • Scan: 600 mm/s
  • Hatch: 80 μm
  • Build plate: 200 °C

Frequently asked questions

What conductivity should I plan for?

Aged L-PBF CuCrZr lands at 75–82% IACS, vs ~85% IACS for wrought. The remaining gap is residual porosity and minor lack-of-fusion.

Sources

  1. UNS C18150 specification
  2. Jadhav, S. D. et al. (2019). Influence of selective laser melting process parameters on Cu microstructure. Materialia 7.

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